Polyimide film with low thermal expansion coefficient is a polyamic acid resin made of new anhydride monomer and new amine monomer. The new polyimide film produced by biaxial stretching process not only has all the excellent properties of ordinary polyamic acid film, but also has higher dimensional stability, high elastic modulus and low thermal expansion coefficient.
First、Skills Requirement
1.Thickness and width
In millimeters
2.Performance
Second、Application field
6052E low thermal expansion coefficient polyimide film has high dimensional stability and similar CTE to copper foil, which is especially suitable for manufacturing copper clad laminate in FPC industry.
